Critical concerns in soldering reactions arising from space confinement in 3-D IC packages

Chuang H.Y.Yang T.L.Kuo M.S.Chen Y.J.Yu J.J.Li C.C.C. ROBERT KAO2019-11-272019-11-27201215304388https://www.scopus.com/inward/record.uri?eid=2-s2.0-84862026416&doi=10.1109%2fTDMR.2012.2185239&partnerID=40&md5=6f3c9b5894888c1f5fdbc13451f0fe2ehttps://scholars.lib.ntu.edu.tw/handle/123456789/432636Critical concerns in soldering reactions arising from space confinement in 3-D IC packagesjournal article10.1109/TDMR.2012.21852392-s2.0-84862026416