Nain, AmitAmitNainTseng, Yu-TingYu-TingTsengGupta, AkashAkashGuptaLin, Yu-FengYu-FengLinArumugam, SangiliSangiliArumugamHuang, Yu-FenYu-FenHuangHuang, Chih-ChingChih-ChingHuangHUAN-TSUNG CHANG2023-11-062023-11-062023-09-2520556756https://scholars.lib.ntu.edu.tw/handle/123456789/636829We have developed multifunctional nanogels with antimicrobial, antioxidant, and anti-inflammatory properties, facilitating rapid wound healing. To prepare the multifunctional nanogels, we utilized quercetin (Qu) and a mild carbonization process to form carbonized nanogels (CNGs). These CNGs possess excellent antioxidative and bacterial targeting properties. Subsequently, we utilized the Qu-CNGs as templates to prepare nanogels incorporating copper sulfide (CuS) nanoclusters, further enhancing their functionality. Notably, the CuS/Qu-CNGs nanocomposites demonstrated an exceptional minimum inhibitory concentration against tested bacteria, approximately 125-fold lower than monomeric Qu or Qu-CNGs. This enhanced antimicrobial effect was achieved by leveraging near-infrared II (NIR-II) light irradiation. Additionally, the CuS/Qu-CNGs exhibited efficient penetration into the extracellular biofilm matrix, eradicating methicillin-resistant Staphylococcus aureus-associated biofilms in diabetic mice wounds. Furthermore, the nanocomposites were found to suppress proinflammatory cytokines, such as IL-1β, at the wound sites while regulating the expression of anti-inflammatory factors, including IL-10 and TGF-β1, throughout the recovery process. The presence of CuS/Qu-CNGs promoted angiogenesis, epithelialization, and collagen synthesis, thereby accelerating wound healing. Our developed CuS/Qu-CNGs nanocomposites have great potential in addressing the challenges associated with delayed wound healing caused by microbial pathogenesis.en[SDGs]SDG3[SDGs]SDG6NIR-activated quercetin-based nanogels embedded with CuS nanoclusters for the treatment of drug-resistant biofilms and accelerated chronic wound healingjournal article10.1039/d3nh00275f377472952-s2.0-85173687914https://api.elsevier.com/content/abstract/scopus_id/85173687914