Effect of UBM Thickness on the Mean Time to Failure of Flip-Chip Solder Joints under Electromigration

Lin, Y.L.Y.L.LinLai, Y.S.Y.S.LaiLin, Y.W.Y.W.LinKao, C.R.C.R.Kao2008-12-312018-06-282008-12-312018-06-282008http://ntur.lib.ntu.edu.tw//handle/246246/95487application/pdf377653 bytesapplication/pdfen-USEffect of UBM Thickness on the Mean Time to Failure of Flip-Chip Solder Joints under Electromigrationjournal articlehttp://ntur.lib.ntu.edu.tw/bitstream/246246/95487/1/10.pdf