Khiabani, NedaNedaKhiabaniChiang, Ching WenChing WenChiangLiu, Nai ChenNai ChenLiuKuan, Yen ChengYen ChengKuanCHUNG-TSE WU2024-03-052024-03-052021-07-0115311309https://scholars.lib.ntu.edu.tw/handle/123456789/640325A new antenna-in-package (AiP) solution for a tightly connected bowtie array antenna using a silicon-based integrated passive device (IPD) on a multilayer printed circuit board (PCB) is developed. The proposed IPD antenna is flip-chipped on the PCB through solder balls and gold studs, whereas a vertical coax-via-based feeding structure is used to provide differential excitation. The proposed 5 {5} array AiP shows a bandwidth of 18.58-100 GHz with differential VSWR \le3.5 when only exciting the central antenna element. The simulations are validated through the fabrication and measurement of prototypes, demonstrating a reasonable agreement in differential VSWR and radiation patterns.Antenna feeds | antenna-in-package (AiP) | coax-via | integrated passive device~(IPD) technology | ultrawideband array antennasjournal article10.1109/LMWC.2021.30749402-s2.0-85104685711https://api.elsevier.com/content/abstract/scopus_id/85104685711