Chang, Chih-Chia BillChih-Chia BillChangC. ROBERT KAO2025-07-072025-07-072025-04-15https://www.scopus.com/record/display.uri?eid=2-s2.0-105007501036&origin=resultslisthttps://scholars.lib.ntu.edu.tw/handle/123456789/730613Au-In is one of the systems used in electronic packaging, including optoelectronics, TIM packaging, and low-temperature soldering. Despite its wide use, however, interfacial reactions in the temperature range of 156.6°C to 250°C remain insufficiently explored, and the mechanical properties of IMCs other than AuIn2 are rarely documented. This study examines the microstructural evolution of Au-In diffusion couples reacted between 165°C and 215°C, utilizing cold ion cross-sectioning, and evaluates IMCs' mechanical properties through indentation methods. The growth kinetics, fitted to a power law, as well as the hardness and reduced modulus of the IMCs, are reported.growth kineticsIMCinterfacial reactionmicroindentationnanoindentationconference paper10.23919/ICEP-IAAC64884.2025.11002768