Effects of slurry formulations on chemical-mechanical polishing of low dielectric constant polysiloxanes: Hydrido-organo siloxane and methyl silsesquioxane

WEN-CHANG CHENYen, Cheng-TyngCheng-TyngYen2018-09-102018-09-102000http://www.scopus.com/inward/record.url?eid=2-s2.0-0033715453&partnerID=MN8TOARShttp://scholars.lib.ntu.edu.tw/handle/123456789/289057Effects of slurry formulations on chemical-mechanical polishing of low dielectric constant polysiloxanes: Hydrido-organo siloxane and methyl silsesquioxanejournal article10.1116/1.5911732-s2.0-0033715453WOS:000085375600036