Hsu, M.-K.M.-K.HsuChang, Y.-W.Y.-W.ChangBalabanov, V.V.BalabanovYAO-WEN CHANG2018-09-102018-09-102011http://www.scopus.com/inward/record.url?eid=2-s2.0-80052663262&partnerID=MN8TOARShttp://scholars.lib.ntu.edu.tw/handle/123456789/365142TSV-aware analytical placement for 3D IC designsconference paper2-s2.0-80052663262