TSV-aware analytical placement for 3D IC designs.

Hsu, Meng-KaiMeng-KaiHsuChang, Yao-WenYao-WenChangBalabanov, ValeriyValeriyBalabanovYAO-WEN CHANG2020-06-162020-06-162011https://scholars.lib.ntu.edu.tw/handle/123456789/501997TSV-aware analytical placement for 3D IC designs.conference paper10.1145/2024724.2024875https://doi.org/10.1145/2024724.2024875