2019-01-012024-05-17https://scholars.lib.ntu.edu.tw/handle/123456789/677640摘要：本研究計畫提出列印方法配合無電鍍技術，於軟性基材上製備出三維結構之電路線路並配合無電電鍍技術，製作出微米級立體電路載體的金屬線路。有別於其他封裝材料之步驟繁複，成本高且體積較為龐大、剛硬等缺點，其我們加以改善並提出創新想法在於可拉伸、可撓曲更貼近穿戴式裝置元件之需求。<br> Abstract: The increasing demands in portable electronics require miniaturized electronic systems on flexible substrates. Three-dimensional high density interconnects (HDI) provides solutions to those microelectronics. To realize rapid prototyping for 3D interconnect, a multidisciplinary team will collaborate on developing fabrication processes for three dimensional metallic microstructures on flexible substrates.三維列印印刷電路金屬線路3d printingprinted circuitsmetal tracks