Chip-to-Chip Direct Interconnections by Using Controlled Flow Electroless Ni Plating

Hung H.T.Yang S.Chen Y.B.C. ROBERT KAO2019-11-272019-11-27201703615235https://www.scopus.com/inward/record.uri?eid=2-s2.0-85014061998&doi=10.1007%2fs11664-017-5385-0&partnerID=40&md5=ce96b9b9f90045be35fee937d9c921b7https://scholars.lib.ntu.edu.tw/handle/123456789/432586Chip-to-Chip Direct Interconnections by Using Controlled Flow Electroless Ni Platingjournal article10.1007/s11664-017-5385-02-s2.0-85014061998