Wu P.-CLee P.-ILai Y.-CLin Y.-CChuang T.-H.TUNG-HAN CHUANG2021-08-052021-08-05202023698136https://www.scopus.com/inward/record.uri?eid=2-s2.0-85097431826&doi=10.11159%2fmmme20.109&partnerID=40&md5=40a99b60eadb488c2d5422bedd5e73b5https://scholars.lib.ntu.edu.tw/handle/123456789/576948The special coincidence twin boundary has many advantageous effects for structural and electronic materials. In this study, nano-twinned Ag films with a strong (111) preferred orientation were sputtered on (111) Si substrates with and without a Ti adhesive layer. The proportion of Σ3 twin boundaries to the total grain boundaries was 47.2%. The addition of a Ti adhesive layer with a thickness of 0.1 μm can effectively reduce the peeling failure of nano-twinned Ag film on (111) Si substrate. ? 2020, Avestia Publishing. All rights reserved.[SDGs]SDG13conference paper10.11159/mmme20.1092-s2.0-85097431826