A comparative molecular dynamics study of copper trench fill properties between Ta and Ti barrier layers

Yang, J.Y.J.Y.YangHong, R.T.R.T.HongHuang, M.J.M.J.Huang2009-01-212018-06-292009-01-212018-06-292005http://ntur.lib.ntu.edu.tw//handle/246246/106769application/pdf328066 bytesapplication/pdfen-USA comparative molecular dynamics study of copper trench fill properties between Ta and Ti barrier layershttp://ntur.lib.ntu.edu.tw/bitstream/246246/106769/1/14.pdf