Performance comparison of flip-chip-assembled 5-GHz 0.18-μm CMOS power amplifiers on different packaging substrates

Kuo, C.-C.C.-C.KuoHsu, Y.-W.Y.-W.HsuHuang, W.-C.W.-C.HuangWang, H.H.WangHSIN-CHIA LUHUEI WANG2020-06-042020-06-042013https://scholars.lib.ntu.edu.tw/handle/123456789/497568Performance comparison of flip-chip-assembled 5-GHz 0.18-μm CMOS power amplifiers on different packaging substratesjournal article10.1109/TCPMT.2013.22822952-s2.0-84890997367https://www.scopus.com/inward/record.uri?eid=2-s2.0-84890997367&doi=10.1109%2fTCPMT.2013.2282295&partnerID=40&md5=a87f1f1f099f31c54ab96d26d1748b18