2004-08-012024-05-18https://scholars.lib.ntu.edu.tw/handle/123456789/707357摘要：本群體計畫針對化銀基板無鉛銲錫球格陣列構裝接點的可靠度及破損機理研究，本 子計畫負責其中的可靠度分析，將進行預處理與冷熱循環試驗，冷熱循環試驗包括熱疲 勞壽命評估與熱疲勞劣化分析兩部份。預處理主要在於評估產品對迴銲製程環境的敏感 性，冷熱循環試驗則模擬銲錫接點實際開關操作的溫度變化。為了比較化銀基板與其它 銲墊表面鍍層的可靠度，本子計畫同時涵蓋化金、化錫與有機OSP 膜，銲錫組成包括： （第一年）Sn 3.5 Ag、Sn 0.9 Cu、Sn 3.8 Ag 0.7 Cu 及（第二年）Sn 51 In、Sn 58 Bi、Sn 9 Zn。本子計畫的冷熱循環試驗主要為熱應力所造成，其結果可與子計畫二的動態疲勞 試驗（由機械應力所造成）相互比較；由於冷熱循環試驗過程鉛錫接點亦伴隨著潛變效 應，子計畫三的高溫潛變試驗可分離此效應；此外，冷熱循環試驗高溫過程銲錫內部將 發生介金屬反應，對接點劣化亦有影響，子計畫五的研究結果將有助於本子計畫可靠度 試驗銲錫接點破損行為解析。<br> Abstract: This group project is focused on the study of the reliability and failure mechanisms of Pb-free solder joints in ball rid array packages when applied with the immersion Ag surface finish. This subprogram is responsible for reliability evaluation, for which the precondition test and temperature cycling test (TCT) are employed. The temperature cycling test involves the evaluation of thermal fatigue life and the analysis of thermal fatigue degradation. The precondition test is used for the evaluation of product sensitivity to the environment of reflow processing, while the TCT is for the simulation of the temperature change during the actual on/off operation of the solder joints. Immersion Au, immersion Sn and organic OSP films are also employed in this project in order to place the joint reliability of the immersion Ag pad in contrast with other surface finishes. The compositions of Pb-free solders are: (First year) Sn3.5Ag, Sn0.9Cu, Sn3.8Ag0.7Cu; and (Second Year) Sn51In, Sn58Bi, Sn9Zn. At this stage, it is the thermal stress that causes failure during the thermal cycling test, principally similar to the failure in Subprogram II caused by mechanical stress during the dynamic fatigue test. The results of this subprogram will therefore be compared with those obtained from dynamic fatigue tests in Subprogram II. During the TCT, a creep effect might also be observed in the solder joints, and the high temperature creep test results in Subprogram III can be utilized to screen such a creep effect in TCT. In addition, during the heating stage of TCT, intermetallic reactions that occur in the solder matrix and at the solder/pad interfaces will spur on the degradation of the solder joints. The results obtained from Subprogram V will be helpful to interpret the failure mechanisms that the reliability tests aim to determine in Subprogram I.表面鍍層（化銀化金化錫有機OSP 膜）無鉛銲錫球格陣列構裝Surface finishes (immersion Agimmersion Auimmersion Snorganic