Effect of solder creep on the reliability of large area die attachment

Zhuang, W.D.W.D.ZhuangChang, P.C.P.C.ChangChou, F.Y.F.Y.ChouShiue, R.K.R.K.ShiueREN-KAE SHIUE2020-05-122020-05-122001https://scholars.lib.ntu.edu.tw/handle/123456789/491913Effect of solder creep on the reliability of large area die attachmentjournal article10.1016/S0026-2714(01)00101-92-s2.0-0035576251https://www.scopus.com/inward/record.uri?eid=2-s2.0-0035576251&doi=10.1016%2fS0026-2714%2801%2900101-9&partnerID=40&md5=109b009137e737e1181a63c2871cd941