Stabilization of the thermal decomposition process of self-reducible copper ion ink for direct printed conductive patterns

Huang, K.-M.K.-M.HuangTsukamoto, H.H.TsukamotoYong, Y.Y.YongChiu, H.-L.H.-L.ChiuNguyen, M.T.M.T.NguyenYonezawa, T.T.YonezawaLiao, Y.-C.Y.-C.LiaoYING-CHIH LIAO2020-01-062020-01-062017https://scholars.lib.ntu.edu.tw/handle/123456789/445959Stabilization of the thermal decomposition process of self-reducible copper ion ink for direct printed conductive patternsjournal article10.1039/c7ra01005b2-s2.0-85021762700https://www.scopus.com/inward/record.uri?eid=2-s2.0-85021762700&doi=10.1039%2fc7ra01005b&partnerID=40&md5=a3ed422d017243354c229bedd74db283