Cross-interaction of UBM and soldering pad in flip-chip solder joints

Tsai, C. M.C. M.TsaiLuo, W. C.W. C.LuoChang, C. W.C. W.ChangShieh, Y. C.Y. C.ShiehKao, and C. R.and C. R.Kao2010-09-032018-06-282010-09-032018-06-282004-12http://ntur.lib.ntu.edu.tw//handle/246246/198765en-USCross-interaction of UBM and soldering pad in flip-chip solder jointsjournal article