Liu HCheng CLi PTZONG-LIN WU2022-04-252022-04-25202200189375https://www.scopus.com/inward/record.uri?eid=2-s2.0-85110833213&doi=10.1109%2fTEMC.2021.3086488&partnerID=40&md5=1559f47d5ad1dc670908dca0a273f518https://scholars.lib.ntu.edu.tw/handle/123456789/607345In this article, a novel circuit is proposed to synthesize absorption common-mode filters (A-CMFs) in only one stage, which can be implemented with different kinds of transmission lines. This proposed one-stage absorption circuit has been derived with analytical equations, and design formulas are found to determine circuit parameters. To validate the proposed circuit and derived formulas, an intuitional structure composed of a meander slotline (MSL), a straight differential pair, and one resistor is proposed. Moreover, a technique named meander asymmetrical coplanar strip (MACPS) has also been developed to reduce the size of MSL-type A-CMF by up to 26%. Finally, the proposed test sample of MACPS-type A-CMF is fabricated in a two-layer printed circuit board (PCB) and measured. The common-mode (CM) noise absorption efficiency of above 80% can be obtained from 2.33 to 2.67 GHz to eliminate CM noises in the Wi-Fi 2.4 GHz band. Besides, the MACPS-type A-CMF provides an excellent differential-mode (DM) signal integrity. The −3 dB bandwidth of DM insertion loss can reach 7.5 GHz, and the measured eye diagram of the proposed work is identical to that of the reference board even the transmitted data rate is up to 16 Gb/s. To our best knowledge, the smallest A-CMF implemented in a two-layer PCB is achieved in this article with the electrical dimension being only 0.0358 λg2. IEEEAbsorptionAbsorption common-mode filter (A-CMF)common-mode (CM) noisecommon-mode filter (CMF)electromagnetic interference (EMI)Filtering theoryImpedanceIntegrated circuit modelingPower transmission linesreflectionless filterResistorsSlot linesElectric network analysisAnalytical equationsCircuit parameterCommon mode noiseCommon-mode filtersDifferential modeDifferential pairsPrinted circuit boards (PCB)Signal IntegrityPrinted circuit boardsjournal article10.1109/TEMC.2021.30864882-s2.0-85110833213