Low temperature bonding for high temperature applications by using SnBi solders

Yang T.L.Wu J.Y.Li C.C.Yang S.C. ROBERT KAO2019-11-272019-11-27201509258388https://www.scopus.com/inward/record.uri?eid=2-s2.0-84947728410&doi=10.1016%2fj.jallcom.2015.05.249&partnerID=40&md5=e09e03fad804a879a3870f3305d15871https://scholars.lib.ntu.edu.tw/handle/123456789/432605Low temperature bonding for high temperature applications by using SnBi soldersjournal article10.1016/j.jallcom.2015.05.2492-s2.0-84947728410