A method for mechanical characterization of capacitive devices at wafer level via detecting the pull-in voltages of two test bridges with different lengths

Hu, Yuh-ChungYuh-ChungHuWEN-PIN SHIHShih, Wen-PinWen-PinShihLee, Guan-DeGuan-DeLee2018-09-102018-09-102007http://www.scopus.com/inward/record.url?eid=2-s2.0-34249667277&partnerID=MN8TOARShttp://scholars.lib.ntu.edu.tw/handle/123456789/330603[SDGs]SDG9A method for mechanical characterization of capacitive devices at wafer level via detecting the pull-in voltages of two test bridges with different lengthsjournal article10.1088/0960-1317/17/6/001