Tze Wee ChenJung Hoon ChunYi-Chang LuReza NavidWei WangChang-Lee ChenRobert W. DuttonYI-CHANG LU2019-10-312019-10-3120091078621xhttps://scholars.lib.ntu.edu.tw/handle/123456789/429925https://www.scopus.com/inward/record.uri?eid=2-s2.0-43549115194&doi=10.1109%2fSOI.2007.4357866&partnerID=40&md5=d8a5196c7d91fe6ed6fb87a073123c18Thermal modeling and device noise properties of 3D-SOI technologyconference paper10.1109/soi.2007.43578662-s2.0-43549115194