Electromigration in flip chip solder joints under extra high current density

Lin, Y.W.Y.W.LinKe, J.H.J.H.KeChuang, H.Y.H.Y.ChuangLai, Y.S.Y.S.LaiC. ROBERT KAO2012-10-242018-06-282012-10-242018-06-282010http://ntur.lib.ntu.edu.tw//handle/246246/243902en-US[SDGs]SDG7Electromigration in flip chip solder joints under extra high current densityjournal article10.1063/1.3371711http://ntur.lib.ntu.edu.tw/bitstream/246246/243902/-1/346.pdf