Electromigration failure in flip chip solder joints due to rapid dissolution of copper

Hu Y.C.Lin Y.H.Kao C.R.Tu K.N.C. ROBERT KAO2019-11-272019-11-27200308842914https://www.scopus.com/inward/record.uri?eid=2-s2.0-0242468675&doi=10.1557%2fJMR.2003.0355&partnerID=40&md5=6ba9e3cce97817e27828bbe1eef72c16https://scholars.lib.ntu.edu.tw/handle/123456789/432725Electromigration failure in flip chip solder joints due to rapid dissolution of copperjournal article10.1557/JMR.2003.03552-s2.0-0242468675