Effect of La addition on the interfacial intermetallics and bonding strengths of Sn-58Bi solder joints with Au/Ni/Cu pads

Shiue, Yu-YunYu-YunShiueChuang, Tung-HanTung-HanChuang2012-10-242018-06-282012-10-242018-06-282010http://ntur.lib.ntu.edu.tw//handle/246246/243925en-USEffect of La addition on the interfacial intermetallics and bonding strengths of Sn-58Bi solder joints with Au/Ni/Cu padsjournal article10.1016/j.jallcom.2009.11.017http://ntur.lib.ntu.edu.tw/bitstream/246246/243925/-1/370.pdf