Intermetallic formation in Sn3Ag0.5Cu and Sn3Ag0.5Cu0.06Ni0.01Ge solder BGA packages with immersion Ag surface finish

Chuang, Tung-HanTung-HanChuangYen, Shiu-FangShiu-FangYenWu, Hui-MinHui-MinWu2009-01-062018-06-282009-01-062018-06-282006http://ntur.lib.ntu.edu.tw//handle/246246/95953application/pdf783504 bytesapplication/pdfen-USIntermetallic formation in Sn3Ag0.5Cu and Sn3Ag0.5Cu0.06Ni0.01Ge solder BGA packages with immersion Ag surface finishjournal articlehttp://ntur.lib.ntu.edu.tw/bitstream/246246/95953/1/95.pdf