Intermetallic compounds formed in In-3Ag solder BGA packages with ENIG and ImAg surface finishes

Chuang, T.H.T.H.ChuangJain, C.C.C.C.JainWang, S.S.S.S.WangTUNG-HAN CHUANG2020-05-122020-05-122009https://scholars.lib.ntu.edu.tw/handle/123456789/491994Intermetallic compounds formed in In-3Ag solder BGA packages with ENIG and ImAg surface finishesjournal article10.1007/s11665-008-9344-z2-s2.0-84864008751https://www.scopus.com/inward/record.uri?eid=2-s2.0-84864008751&doi=10.1007%2fs11665-008-9344-z&partnerID=40&md5=68910e4d5de62af29ce5bf8ebe076160