Ho C.E.Lin Y.L.C. ROBERT KAO2019-11-272019-11-27200208974756https://www.scopus.com/inward/record.uri?eid=2-s2.0-0036209651&doi=10.1021%2fcm010639h&partnerID=40&md5=db76184a7b0af93106581342c6d200echttps://scholars.lib.ntu.edu.tw/handle/123456789/432728Strong effect of Cu concentration on the reaction between lead-free microelectronic solders and Nijournal article10.1021/cm010639h2-s2.0-0036209651