Pattern formation during interfacial reaction in-between liquid Sn and Cu substrates

Ke J.H.Gao Y.Kao C.R.Wang Y.C. ROBERT KAO2019-11-272019-11-27201613596454https://www.scopus.com/inward/record.uri?eid=2-s2.0-84966709689&doi=10.1016%2fj.actamat.2016.05.004&partnerID=40&md5=9de4d4997c696e7cea96848fb1f54a86https://scholars.lib.ntu.edu.tw/handle/123456789/432596Pattern formation during interfacial reaction in-between liquid Sn and Cu substrates - A simulation studyjournal article10.1016/j.actamat.2016.05.0042-s2.0-84966709689