張慶源2006-07-262018-06-282006-07-262018-06-282000-07-31http://ntur.lib.ntu.edu.tw//handle/246246/22052本研究之目的在於以臭氧或臭氧/紫外 光程序直接去除印刷電路板工業所使用酸 性電鍍液中的聚乙二醇。電鍍液中的基質 (主要化學成份)為無機物，例如硫酸、硫酸 銅等。臭氧氧化主要係去除佔少部份的有 機添加劑(如聚乙二醇)。 本研究以半批式實驗建立常溫(25℃) 時，臭氧在電鍍液基質中自解及光自解的 反應動力參數(反應速率常數及反應階 數)。在臭氧/聚乙二醇或臭氧/紫外光/聚乙 二醇反應中，本研究提出兩階段反應模式 來說明液相臭氧濃度及總有機碳(total organic carbon, TOC)的變化。The objective of this study is to remove polyethylene glycol (PEG) from the acidbased electroplating solution of printed wiring board (PWB) industry by ozone (O3) or ozone/ultraviolet (UV) processes. The substrates (the major chemical species) of the electroplating solution recipe are inorganics, such as sulfuric acid, copper sulfate, etc. Ozonation mainly destroys the minor organic additives (PEG, for example). The study establishes the kinetic expressions of the ozone self-decomposition reactions in the electroplating solution substrate with and without UV radiation by semi-batch experiments. In O3/PEG or O3/UV/PEG reactions, the reaction kinetics may be simulated by a two-step reaction mechanism in terms of O3 and total organic carbon (TOC).application/pdf136766 bytesapplication/pdfzh-TW國立臺灣大學環境工程學研究所臭氧聚乙二醇電鍍液總有 機碳Ozonepolyethylene glycolelectroplating solutiontotal organic carbonsreporthttp://ntur.lib.ntu.edu.tw/bitstream/246246/22052/1/892211E002025.pdf