Development of Low-Temperature, Pressureless Copper-to-Copper Bonding by Microfluidic Electroless Interconnection Process

Yang S.Hung H.-T.Nishikawa H.C. ROBERT KAO2019-11-272019-11-272018978153864998505695503https://www.scopus.com/inward/record.uri?eid=2-s2.0-85051920068&doi=10.1109%2fECTC.2018.00054&partnerID=40&md5=316cf84046de47718e6b5ed4d853f5a2https://scholars.lib.ntu.edu.tw/handle/123456789/432575Development of Low-Temperature, Pressureless Copper-to-Copper Bonding by Microfluidic Electroless Interconnection Processconference paper10.1109/ECTC.2018.000542-s2.0-85051920068