Interactions between solder and metallization during long-term aging of advanced microelectronic packages

Ho C.E.Chen W.T.C. ROBERT KAO2019-11-272019-11-27200103615235https://www.scopus.com/inward/record.uri?eid=2-s2.0-0035305461&doi=10.1007%2fs11664-001-0047-6&partnerID=40&md5=960a3f31005adf4335288b12742228a9https://scholars.lib.ntu.edu.tw/handle/123456789/432741Interactions between solder and metallization during long-term aging of advanced microelectronic packagesjournal article10.1007/s11664-001-0047-62-s2.0-0035305461