Ultrasonic Bonding of Ag and Ag-Alloy Ribbon - An Innovative Alternative for High Power IC Packages

Chen, C.-H.C.-H.ChenLin, Y.-C.Y.-C.LinGroth, A.A.GrothLai, Y.-C.Y.-C.LaiLin, C.-Y.C.-Y.LinChang, H.-M.H.-M.ChangChuang, T.-H.T.-H.ChuangTUNG-HAN CHUANG2021-02-042021-02-042020https://www.scopus.com/inward/record.url?eid=2-s2.0-85086066293&partnerID=40&md5=e3ae3643a92ca36385a571715c0fb32bhttps://scholars.lib.ntu.edu.tw/handle/123456789/546731[SDGs]SDG7Ultrasonic Bonding of Ag and Ag-Alloy Ribbon - An Innovative Alternative for High Power IC Packagesjournal article10.1109/TCPMT.2020.29881292-s2.0-85086066293WOS:000541132400016