2004-08-012024-05-18https://scholars.lib.ntu.edu.tw/handle/123456789/709627摘要：微機電系統乃是目前科技界人士公認最具未來發展潛力及前瞻性的研究領域之一，本計畫將中我們將充分運用台灣現有領先世界的晶圓代工優勢，巧妙地整合微感測器、微致動器和電子電路於同一晶片之中，同時並利用與積體電路相容之微機電技術來設法改善目微波元件之高頻特性，適時地為我國建立CMOS-MEMS發展平台的關鍵技術。 本研究提出幾種適用於無線通訊被動元件或模組之底材改善和改造方法： 其中我們採用一新型矽基材濕蝕刻構想以及一種與現今標準積體電路製造程序完全相容之微電鍍技術，在以不變動上方堆疊之各層結構為前提下將元件下方之底材去除或是重建元件金屬化製程以避免嚴重的雜散電阻效應。此類作法之特點為可提高元件封裝後之可靠度且製程簡單。另外本計畫亦提出基材之多孔矽改造方法，吾人將嘗試以電化學蝕刻方式將元件底材改造為多孔矽，即藉由多孔矽的奈米級微細結構來調變底材之有效介電係數進而達到吾人所需之高頻特性。<br> Abstract: Micro-Electro-Mechanical-Systems (MEMS) has been generally accepted as one of the most influential technologies in this decade. In this project, we will utilize the advantage of domestic world-class foundry services to integrate sensors, actuators, and microelectronics into single chips with the aim of establishing the foundation of CMOS-compatible MEMS technologies. In this project, we will study several approaches to reduce the eddy-current loss of silicon substrate or resistive loss of metallic materials in standard CMOS process. Removing part of the silicon substrate and then building high frequency passive components by micro-electroplating without modifying the structural layers is the central concept of the first approach. In the second approach, we will try to electromechanically convert part of the silicon substrate into porous silicon. The idea is to reduce substrate loss while keeping dielectric constant and structural strength intact.積體電路微機電感測器致動器無線通訊光通訊CMOSMEMSsensoractuatorwirelessopticalcommunication