2020-06-012024-05-15https://scholars.lib.ntu.edu.tw/handle/123456789/663734微觀三維量測(Microscopic 3D Measurement): 發展運用結構光投射原理之全域性三維量測技術與探頭，具絕對深度量測能力與高深度解析之三維量測能力: 量測準確度可小於0.03% of全深量測範圍，Depth resolution: 0.5 &#181;m，其量測重覆度可達 1.0 &#181;m @ 2 Sigma. (2) 創新式複雜工件之辨識與空間定位關鍵演算技術: 以所發展的演算法，進一步發展出具嵌入式硬體保護的DLL or LIB 軟體程式庫，以供未來技轉使用。 (3) 創新式工件關鍵尺寸(critical dimension, CD) 與特徵的自動化精密量測技術: 依據系統使用者所選定檢測的工件關鍵尺寸或特徵選項，自動決定量測的最佳空間位移路徑與量測最佳的探頭姿態及位置，進行高精度之三維形貌與CD量測，進行量測點雲資料與CAD model之間精密影像疊合，以求出工件形狀誤差分佈，以及關鍵尺寸(孔洞中心位置與直徑、曲面法線向量、形貌特徵等)或影像特徵。 <br> Abstract: This project is aimed to develop an advanced intelligent optical precise measuring module to be integrated with 6-axis robots for achieving the goals set in Vision 4.0 -- Smart Vision for Smart Factories. This developed system can be used to perform intelligent and accurate automatic optical surface scanning and profilometry on workpieces with complicated surface geometry, such as turbine blades used in aerospace engines. Based on what have been established in the last three years, the 4th-Year project aims to consolidate the following three key techniques required in the system integration with 6-axis robots: 1.Innovative optical measuring probe and algorithms 2.Novel algorithms for object recognition and accurate orientation positioning of measured workpieces having complicated surface geometry: 3.Novel algorithms for automated critical dimension (CD) extraction from scanned point clouds Meanwhile, this project aims to develop three prototypes by working with three cooperative companies through industrial grant support and technological transfer: 1.Development of the key techniques to detect 3D positioning and orientation detection of an in-situ robot for real-time monitoring of the robot health condition. (with CXsemi Company Limited) 2.Development of the key techniques to optically recognize and position of an object having complex surface geometry and extract critical dimension (CD) and form errors of it. (with JetTech Company Limited) 3.Development of automated optical system for inspecting micro-bumps or other micro components in the semiconductor packaging processes. (with Vision Inspection Company Limited)Vision 4.0自動化光學檢測(AOI)智慧型機器視覺光學精密量測自動化量測Vision 4.0automated optical inspection (AOI)Intelligent machine visionOptical metrologyAutomated measurement.