Solvent debinding behavior of powder injection molded components prepared from powders with different particle sizes

Hwang, K. S.K. S.HwangShu, G. J.G. J.ShuLee, H. J.H. J.Lee2008-12-312018-06-282008-12-312018-06-282005http://ntur.lib.ntu.edu.tw//handle/246246/95546application/pdf591715 bytesapplication/pdfen-USSolvent debinding behavior of powder injection molded components prepared from powders with different particle sizesjournal articlehttp://ntur.lib.ntu.edu.tw/bitstream/246246/95546/1/23.pdf