Chang, F.L.F.L.ChangChen, Y. C.Y. C.ChenLin, Y. H.Y. H.LinWu, P. K.P. K.WuChuang, M. C.M. C.ChuangC. ROBERT KAO2024-07-152024-07-152024-01-019784991191176https://www.scopus.com/record/display.uri?eid=2-s2.0-85195520685&origin=resultslisthttps://scholars.lib.ntu.edu.tw/handle/123456789/719786In order to minimize the energy consumption and thermal warpage during reflow process, low-temperature solder have become a hot research area in recent years. In this study, Sn-Bi system was chosen as the starting point for the study of low-temperature solders. By increasing the proportion of Sn and adding additional elements in Sn-Bi solder, it was expected that the melting point will be lowered and the mechanical properties will be improved at the same time. Then, influence of Sb addition on Sn-Bi solder grain refinement before and after thermal aging was investigated. Finally, several properties of different additional elements, including melting point, interfacial reaction, wettability and microstructure evolution were investigated.falseInterfacial reactionLow-temperature solderMicrostructureSn-Bi solderWettabilityconference paper10.23919/ICEP61562.2024.10535662-s2.0-85195520685