Reflow and burn-in of a Sn-20In-0.8Cu ball grid array package with a Au/Ni/Cu pad

Chiang, M. J.M. J.ChiangChang, S. Y.S. Y.ChangChuang, T. H.T. H.Chuang2009-01-062018-06-282009-01-062018-06-282004http://ntur.lib.ntu.edu.tw//handle/246246/95943application/pdf373665 bytesapplication/pdfen-USReflow and burn-in of a Sn-20In-0.8Cu ball grid array package with a Au/Ni/Cu padjournal articlehttp://ntur.lib.ntu.edu.tw/bitstream/246246/95943/1/85.pdf