陳立仁臺灣大學：化學工程學研究所許志豪Hsu, Chio-HaoChio-HaoHsu2007-11-262018-06-282007-11-262018-06-282007http://ntur.lib.ntu.edu.tw//handle/246246/52130本研究擬利用微觸印刷法以及無電電鍍法來製作微米級以及次微米級的金屬銅銀圖案，製作的圖案為0.6~10 μm且間隔0.6~10 μm的線條狀圖案，製程可分為兩種，直接蓋印法 ( printing seeding layer ,PSL ) 以及蓋印遮護層法 ( printing masking layer , PML )。直接蓋印法是直接利用微觸印刷蓋上種晶層的圖案，再將基材去做無電電鍍出金屬圖案，而蓋印遮護層法則是利用微觸印刷蓋印能阻擋種晶層的分子膜 (在本研究為 OTS)，而後將基材泡入種晶層溶液，則可有效的阻擋種晶。另外為了改進無電電鍍金屬膜的附著性問題，我們也利用了溶膠凝膠法 ( sol-gel ) 來增加基材的表面粗糙度，以及利用基材氧氣電漿的預處理來改善製程以及節省製程時間。 另外，在本研究中我們也嘗試利用微觸印刷法以及化學沉積法來製作高分子導電薄膜聚苯胺的圖案，同時我們也利用拉伸實驗來探討了聚苯胺的導電性與膜本身的聚合密度之間的關係。Microcontact printing (μCP) and electroless plating are combined to produce micro-scale patterns of silver and copper on glass substrates. We fabricate copper and silver line patterns with feature sizes of 0.6~10 μm in length and separated by 0.6~10 μm by using two methods: (1) The printing seeding layer (PSL) method is to apply μCP to directly print the surface-active reagent pattern for further electroless plating. (2) The printing masking layer (PML) method is to use μCP to print the octadecyltrichlorosilane (OTS) self-assembled monolayer as a masking layer on glass substrates. We discuss the relation between the surface roughness and the adhesion property of copper and silver film. We use sol-gel process to increase the surface roughness. We also use the oxygen plasma pretreatment to increase the SAM quality, and to simplify the experimental procedure. Conducting polymer polyaniline pattern is fabricated by the printing masking layer (PML) method with feature sizes of 10 μm lines and separated by 10 μm. We discuss the conductivity of polyaniline film at different stretching conditions.TABLE OF CONTENTS Abstract (in Chinese) ---------------------------------------------------------------------------I Abstract (in English) ---------------------------------------------------------------------------II Table of Content--------------------------------------------------------------------------------III List of Tables ------------------------------------------------------------------------------------V List of Figures ----------------------------------------------------------------------------------VI CHAPTER 1 Introduction -------------------------------------------------------------------1 CHAPTER 2 Literature Review --------------------------------------------------------------6 2-1 Microcontact printing--------------------------------------------------------------------6 2-2 Electroless plating -----------------------------------------------------------------------9 2-3 Use Sn as the catalyst to fabricate silver pattern -----------------------------------11 2-4 Use Pd as the catalyst to fabricate silver and copper patterns -------------------12 2-5 Surface roughness and adhesion property ------------------------------------------14 2-6 Conducting polymer polyaniline -----------------------------------------------------17 CHAPTER 3 Experimental Methods ------------------------------------------------------30 3-1 Experimental preparation-------------------------------------------------------------31 3-2 Patterns of silver fabricated by Sn-activated surface ----------------------------32 3-3 Patterns of silver and copper fabricated by Pd activated surface ---------------35 CHAPTER 4 Results and Discussion -------------------------------------------------------44 4-1 Fabrication of silver patterns by Sn-activated surfaces --------------------------44 4-2 Fabrication of silver and copper patterns byPd-activated surfaces ------------51 CHAPTER 5 Conducting Polymer Polyaniline --------------------------------------------87 5-1 Experimental method ----------------------------------------------------------------87 5-2 Results and discussion ---------------------------------------------------------------88 CHAPTER 6 Conclusions and Future Works---------------------------------------------100 APPENDIX A: Abbreviation of Symbols--------------------------------------------------102 APPENDIX B: Formulation Table of Electroless Copper Plating Solution-----------103 Formulation Table of Electroless Silver Plating Solution-------------103 References--------------------------------------------------------------------------------------1048718147 bytesapplication/pdfen-US微觸印刷無電電鍍直接蓋印法蓋印遮護層法溶膠凝膠法化學沉積法microcontact printingelectroless platingprinting seeding layerprinting masking layersol-gel processchemical depositionthesishttp://ntur.lib.ntu.edu.tw/bitstream/246246/52130/1/ntu-96-R94524058-1.pdf