Hong, Y.Y.HongHeller, G.G.HellerCheng, I.-C.I.-C.ChengKattamis, A.A.KattamisWagner, S.S.WagnerI-CHUN CHENG2018-09-102018-09-102006http://www.scopus.com/inward/record.url?eid=2-s2.0-33847406759&partnerID=MN8TOARShttp://scholars.lib.ntu.edu.tw/handle/123456789/323879Stainless steel foil substrates: Robust, low-cost, flexible active-matrix backplane technologyconference paper