2018-11-012024-05-17https://scholars.lib.ntu.edu.tw/handle/123456789/695512摘要：樂金公司與台灣大學合作研發首創IC及LED封裝銀合金銲線，已經在電子產業廣泛應用；因應功率IC產品的發展趨勢，樂金公司以其銀合金線材產品與技術優勢，積極開發功率模組用銀合金帶材，以取代傳統粗鋁線及鋁帶材。本計畫主要利用本實驗室建立之銀合金線材與帶材電子背向散射繞射技術分析技術(EBSD)，協助樂金公司產品達成市場需求。研究重點在於探討銀合金帶材在不同的軋延與退火製程參數下的材料特性與晶粒結構，透過調控晶粒大小、晶格取向與孿晶界密度等材料結構因子，帶材之物理與機械性質可以有效獲得改良，藉此提升樂金公司銀合金帶材產品對功率IC封裝的適用性。實驗用帶材包含Ag-4Pd與新開發超高導電率銀合金合金組成，帶材尺寸為厚度50至100&#61549;m，寬度1000&#61549;m。研究亦包含這兩種銀合金帶材超音波接合的界面觀察、接合強度量測及材料變形結構。<br> Abstract: An innovative Ag-alloy bonding wire for IC and LED packaging has been developed by Wire Technology Co. LTD and National Taiwan University has been verified and widely applied in electronic industry. Due to the trend of power IC products, WT co. is devoting to the development of Ag-alloy ribbon for power modules to substitute the tradition coarse Al wire and Al ribbon with its advantages of Ag-alloy wire products and techniques. This project uses the Electron Back Scatter Diffraction analysis techmplogy (EBSD) to assist the products of WT co. to attain the market requirements. The focuse of this study is on the investigation of the materails characteristics and grain structure of Ag-alloy ribbons after various rolling and annealing parameters. Through the modification of material structure factors such as: grain size, lattice orientation and twin boundary density, the physical and mechanical properties of ribbons can be effectively improved and the applicability of WT- Ag alloy ribbon products for the Power IC packages can be promoted. The experimental ribbons include an Ag-4Pd and a newly developed super conductive Ag-alloy compositions. The size of ribbons has a thickness of 50 to 100&#61549;m and a width of 1000&#61549;m. The research also contains the observations of interfaces, bonding strength and material deformation structure of both ultrasonic bonded Ag-alloy ribbons.功率模組封裝銀合金帶材軋延退火熱處理材料特性晶粒結構調控power modules packagingAg-alloy ribbonsrollingannealingmaterials characteristicsmodification of grain structure.