In-situ observation of the void formation-and propagation mechanism in solder joints under current-stressing

Lin, Y. H.Y. H.LinHu, Y. C.Y. C.HuTsai, C. M.C. M.TsaiKao, C. R.C. R.KaoTu, and K. N.and K. N.Tu2010-09-032018-06-282010-09-032018-06-282005-04http://ntur.lib.ntu.edu.tw//handle/246246/198766en-USIn-situ observation of the void formation-and propagation mechanism in solder joints under current-stressingjournal article