Reactions of Sn-4.0Ag-0.5Cu on Cu and electroless Ni substrate in premelting soldering process

Chung C.K.Chen Y.J.Yang T.L.C. ROBERT KAO2019-11-272019-11-27201303615235https://www.scopus.com/inward/record.uri?eid=2-s2.0-84877750407&doi=10.1007%2fs11664-013-2582-3&partnerID=40&md5=0218fd05e8e837b04ecd6aa593fb4c97https://scholars.lib.ntu.edu.tw/handle/123456789/432629Reactions of Sn-4.0Ag-0.5Cu on Cu and electroless Ni substrate in premelting soldering processjournal article10.1007/s11664-013-2582-32-s2.0-84877750407