郭斯彥臺灣大學：電機工程學研究所徐文正Hsu, Wen-ChengWen-ChengHsu2007-11-262018-07-062007-11-262018-07-062006http://ntur.lib.ntu.edu.tw//handle/246246/53065隨著超大型積體電路設計與製造技術的不斷演進，使得價格便宜、體積輕薄短小、功能多樣化的嵌入式產品不斷的問世。舉凡個人數位助理系統、智慧型手機、數位相機、衛星導航系統…等嵌入式系統的產品都是嵌入式系統應用的典型案例。而為了在市場上具有競爭力除了價格便宜、體積輕薄短小、功能多樣化之優點外，還必須具備開發時程短、省電、性能優越等特性。 也正因為技術的快速演進，客戶需求相對的也會快速變更；在日益縮短的產品生命週期中，嵌入式系統的供應者該如何運用新的硬體零組件持續開發新產品，以及滿足使用者對新功能和新介面的需求，就是一道重要的課題。在嵌入式系統中最常採用的便是可程式化的微處理器。利用嵌入式系統軟體來驅動微處理器以及相關的硬體零組件來達成整個系統所需的功能。 在本論文中，我們將以嵌入式系統為基本，搭配歐規的第二代行動電話技術，以及藍芽和WiFi等無線傳輸技術來設計並驗證個人無線行動通訊手機系統。最後，並實際測試電話相關的功能，以驗證其功能的正確性。Along with the VLSI circuit design and the manufacture technology unceasing evolution, frivolously causes the price small advantage, the volume to be short, the function diversification inserts type product unceasing being published. All Personal Digital Assistant (PDA) system, Smart handset, digital camera, satellite navigational system ..., those embedded systems are the typical cases of embedded type system application. But in order to has the competitive ability frivolously in the market except the price small advantage, the volume short, merit of outside the function diversification, but also must have the development time interval short, the province electricity, the performance is superior and so on the characteristic. Also because of the technical fast evolution, the customer demand relative also can fast change; in reduces day by day in the product life cycle, embedded system how should the supplier utilize the new hardware zero module to continue to develop the new product, as well as satisfies the user and newly lies between to the new function the surface demand, is the important topic. In embedded system most often to use then is may the formula microprocessor. Using embedded system software to actuate the microprocessor as well as the correlation hardware zero module achieves the function which the overall system needs. Because the handset user grows day by day, and wireless transmission technology unceasing weeding through the old to bring forth the new, thereupon develops one kind of knot divisible number assistant, the handset function and the wireless transmission integrated system: Personal Digital Assistant (PDA) Phone system. In the present paper, we take embedded system as to be basic, match European specification the second electricity mobile phone technology, as well as the Bluetooth and WiFi and so on the wireless transmission technology and the Microsoft new generation embedded system to design and really to make the handset system. Finally, and actual tests in the telephone correlation function, confirms its function the accuracy.Contents CHAPTER 1. INTRODUCTION.....................................................................9 1.1 ABOUT THIS PAPER........................................................................9 1.1.1 Purpose...............................................................................9 1.1.2 Scope.................................................................................9 1.1.3 Organization of this Document.........................................................9 1.2 EMBEDDED SYSTEM.........................................................................9 1.2.1 Characteristics of Embedded System....................................................9 1.2.2 Embedded OS...........................................................................10 1.3 MICROSOFT WINDOWS MOBILE 5.0 OPERATING SYSTEM...........................................10 1.4 RADIO INTERFACE LAYER...................................................................13 1.5 PCS GENERATION (GSM/GPRS/WCDMA/HSDPA)...................................................15 1.5.1 GSM...................................................................................16 1.5.2 GPRS..................................................................................17 1.5.3 WCDMA.................................................................................18 1.5.4 HSDPA.................................................................................21 1.5.5 Dual mode protocol architecture.......................................................21 CHAPTER 2. BACKGROUND AND RELATED WORKS.....................................................22 2.1 BOARD SUPPORT PACKAGES (BSPS)...........................................................22 2.1.1. System Requirements..................................................................23 2.1.1.1. Software Requirements..............................................................23 2.1.1.2. Host System Requirement............................................................23 2.1.1.3. Target Requirements................................................................23 2.1.1.4. Flash Component Requirements.......................................................23 2.1.2. Using choice BSP.....................................................................23 2.1.3. OS Debug image.......................................................................24 2.1.4. KITL over USB........................................................................24 2.1.5. Cellular Phone Support...............................................................24 2.1.6. Loading Image via EBOOT..............................................................25 2.1.7. EBOOT options........................................................................26 2.1.7.1. Option (2) Boot Delay..............................................................26 2.1.7.2. Option (4) Reset to Factory Default Configuration..................................26 2.1.7.3. Option (6) Boot Device Order.......................................................26 2.1.7.4. Option (7) Debug Serial Port: BTUART/FFUART/STUART.................................26 2.1.7.5. Option (D) Download Image..........................................................26 2.1.7.6. Option (L) Launch Existing Flash Resident Image....................................27 2.2 PLATFORM BUILDER........................................................................27 2.2.1 Setup Platform Builder to support USB KITL............................................27 2.2.2 Release Directory Modules.............................................................29 2.2.3 KITL How to...........................................................................30 2.3 PORTING THE BOARD INITIALIZATION SOFTWARE...............................................33 2.3.1 Board Initialization..................................................................33 2.3.2 EBOOT.................................................................................34 2.3.3 Porting the Display Driver............................................................34 2.3.3.1 Display Driver Files................................................................34 2.3.3.2 LCD Configuration in System Files...................................................34 2.3.3.3 Identify the LCD Panel to the System................................................36 2.3.4 Porting the FFUART, BTUART, and STUART Drivers........................................36 2.3.4.1 UART Drivers Files..................................................................37 2.3.4.2 UART Constants......................................................................39 2.3.4.3 UART Specific Codes.................................................................39 2.3.4.4 GPIO Mapping........................................................................39 2.3.4.5 Registry Configuration for Multiple COM Ports.......................................40 CHAPTER 3. RADIO INTERFACE LAYER............................................................43 3.1. RIL INTRODUCTION.......................................................................43 3.2. RIL MODEM INTERFACE....................................................................44 3.2.1. One UART, One COM....................................................................45 3.2.2. One UART, Two COM....................................................................45 3.2.3. Two UART, Two COM....................................................................45 3.2.4. URC..................................................................................46 3.3. RIL MODEM INTERFACE WITH OTHER MODULES.................................................46 3.3.1. Interface between RIL and Upper Layer................................................46 3.3.2. Interface between PPP and VSP........................................................47 3.4. RIL APIS...............................................................................47 3.5. MODIFICATION FOR SELECTED MODEM........................................................53 3.5.1. Power Management.....................................................................53 3.5.2. Audio Management.....................................................................56 3.5.3. SMS Handling.........................................................................57 3.5.4. SIM Toolkit..........................................................................57 3.5.5. Own Number...........................................................................60 3.6. ADDITIONAL MODIFICATIONS...............................................................62 3.6.1. Hardware Abstraction Layer...........................................................62 3.6.2. GSM 22.10 Multiplexer................................................................62 3.6.3. RIL Extensions.......................................................................63 CHAPTER 4. DEVICE TEST......................................................................65 4.1. RIL STANDARD DEVELOPMENT TESTING.......................................................65 4.2. OPERATOR TESTING.......................................................................65 4.3. LOGO TEST KIT (LTK) TESTING............................................................66 4.4. RADIO QUALITY METRIC TESTING...........................................................69 CHAPTER 5. CONCLUSION.......................................................................70 5.1. SUMMARY................................................................................70 5.2. FUTURE WORKS...........................................................................70 REFERENCES..................................................................................71 APPENDIX A: ABBREVIATIONS...................................................................741854944 bytesapplication/pdfen-US嵌入式系統行動通訊EmbeddedMobile Communicationthesishttp://ntur.lib.ntu.edu.tw/bitstream/246246/53065/1/ntu-95-P93921009-1.pdf