Yang S.Hung H.T.Chen Y.B.C. ROBERT KAO2019-11-272019-11-2720169784904090176https://www.scopus.com/inward/record.uri?eid=2-s2.0-84978224582&doi=10.1109%2fICEP.2016.7486876&partnerID=40&md5=1ba56af57bd833b6ff6445e9628b6c53https://scholars.lib.ntu.edu.tw/handle/123456789/432600Bonding of copper pillars using electroless Ni platingconference paper10.1109/ICEP.2016.74868762-s2.0-84978224582