吳宗霖臺灣大學:電信工程學研究所韓子偉Han, Tzu-WeiTzu-WeiHan2007-11-272018-07-052007-11-272018-07-052007http://ntur.lib.ntu.edu.tw//handle/246246/58669Abstract Transient current surges resulted from the simultaneous switching of output buffers in the high-speed digital circuits can induce significant ground bounce noise (GBN) on the chip, package, and printed circuit board (PCB). The GBN not only causes the signal integrity problems but also deteriorate the EMI in the high-speed digital circuits. With the design trends of digital circuits toward higher speed, lower voltage level, and smaller package size, the impact of GBN has become one of the most important issues that determine the performance of electronic systems. In this thesis we propose a novel power distribution structure with stopband enhancement by introducing the concept of “Artificial substrate”. Based on the conventional coplanar EBG power plane, it is fabricated by periodically embedding materials with different dielectric constant between the power and ground plane to perturb the effective dielectric constant for different resonance modes. It is found that with proper design of the positions and dielectric constant of the embedded materials, the stopband bandwidth can be enhanced by reducing the frequency of the first mode and increasing the frequency of the second one at the same time. This idea is verified by simulation and measurement both in time- and frequency-domain. Over 60% bandwidth enhancement for the SSN suppression is achieved in this work.Table of Contents Abstract……………………………………………………………………………...Ⅰ Table of Contents……………………………………………………………………Ⅲ List of Figures……………………………………………………………………….Ⅴ Acronyms……………………………………………………………………………Ⅷ 1 Introduction 1 1.1 Research Motivations....................................................................................1 1.2 Simultaneously Switching Noise (SSN) in Power Distribution Network (PDN).............................................................................................................2 1.3 High-speed digital circuit design trends and Challenges...............................4 1.4 Objective and Organization of this Dissertation............................................5 2 Typical Solution to SSN Problem . 7 2.1 Split Power Plane for Noise Isolation............................................................7 2.2 Decoupling Capacitors for SSN suppression...............................................10 2.3 High-Impedance Surface (HIS)...................................................................13 2.4 Coplanar electromagnetic bandgap (EBG) structure...................................18 2.5 Photonic Crystal Power/Ground Structure (PCPL)........19 2.6 Summary...................................21 3 Two-Dimensional Method for Bandgap Estimation 22 3.1 One-Dimensional Approach...................................23 3.2 2-D Transmission Line Model and Dispersion Diagram Calculation….....29 4 Artificial-Substrate EBG Power/Ground Structure 33 4.1 Design Concept of AS-EBG Structure...................................34 4.2 Equivalent Circuit Model of the AS-EBG power/ground planes…………36 4.3 PI Performance............................................47 4.3.1 Frequency Domain........................................47 4.3.2 Time Domain...................................51 4.4 EMI Performance...................................59 4.5 Summary...................................60 5 Conclusion 62 Reference 631005602 bytesapplication/pdfen-US切換雜訊電源完整性信號完整性電磁能隙系統封裝SSNPIEBGArtificial SubstrateSoP應用於高速系統封裝之新型電磁能隙電源平面設計A Novel Electromagnetic Bandgap (EBG) Power Plane for High-Speed System on Package Designthesishttp://ntur.lib.ntu.edu.tw/bitstream/246246/58669/1/ntu-96-R94942067-1.pdf