Intermetallic reactions in reflowed and aged Sn-9Zn solder ball grid array packages with Au/Ni/Cu and Ag/Cu pads

Lin, Hsiu-JenHsiu-JenLinChuang, Tung-HanTung-HanChuang2009-01-062018-06-282009-01-062018-06-282006http://ntur.lib.ntu.edu.tw//handle/246246/95951application/pdf885988 bytesapplication/pdfen-USIntermetallic reactions in reflowed and aged Sn-9Zn solder ball grid array packages with Au/Ni/Cu and Ag/Cu padsjournal articlehttp://ntur.lib.ntu.edu.tw/bitstream/246246/95951/1/93.pdf