Sintered Micro-Silver Paste Doped with Indium for Die Attachment Applications of Power ICs

Tsai, C.-H.C.-H.TsaiHuang, W.-C.W.-C.HuangKao, C.R.C.R.KaoChew, L.M.L.M.ChewSchmitt, W.W.SchmittNishikawa, H.H.NishikawaC. ROBERT KAO2021-02-042021-02-042020https://www.scopus.com/inward/record.url?eid=2-s2.0-85090295378&partnerID=40&md5=1dbf0c7aecdfe51299fff0014153dfe3https://scholars.lib.ntu.edu.tw/handle/123456789/546625[SDGs]SDG7Sintered Micro-Silver Paste Doped with Indium for Die Attachment Applications of Power ICsconference paper10.1109/ECTC32862.2020.002262-s2.0-85090295378