Nonperiodic Flipped EBG for Dual-Band SSN Mitigation in Two-Layer PCB

Hsieh, H.-C.H.-C.HsiehChan, H.-W.H.-W.ChanWang, Y.-C.Y.-C.WangLin, Y.-H.Y.-H.LinWang, W.-S.W.-S.WangWang, S.-H.S.-H.WangRUEY-BEEI WU2021-05-052021-05-052019https://www.scopus.com/inward/record.url?eid=2-s2.0-85073803129&partnerID=40&md5=f45c6d18d0727972645abe0729fe8704https://scholars.lib.ntu.edu.tw/handle/123456789/559157Nonperiodic Flipped EBG for Dual-Band SSN Mitigation in Two-Layer PCBjournal article10.1109/TCPMT.2019.29334902-s2.0-85073803129