Intermetallic Formation in Sn3Ag0.5Cu and Sn3Ag0.5Cu0.06Ni0.01Ge Solder BGA Packages with Au/Ni/Cu Pads

Chuang, T. H.T. H.ChuangYen, S. F.S. F.YenCheng, M. D.M. D.Cheng2010-09-032018-06-282010-09-032018-06-282006-02http://ntur.lib.ntu.edu.tw//handle/246246/198773en-USIntermetallic Formation in Sn3Ag0.5Cu and Sn3Ag0.5Cu0.06Ni0.01Ge Solder BGA Packages with Au/Ni/Cu Padsjournal article