Microstructural evolution at the bonding interface during the early-stage infrared active brazing of alumina

Shiue, R.K.R.K.ShiueWu, S.K.S.K.WuHu, J.M.J.M.HuWang, J.Y.J.Y.WangSHYI-KAAN WU2018-09-102018-09-102000http://www.scopus.com/inward/record.url?eid=2-s2.0-0034292579&partnerID=MN8TOARShttp://scholars.lib.ntu.edu.tw/handle/123456789/288866Microstructural evolution at the bonding interface during the early-stage infrared active brazing of aluminajournal article